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Company History

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Company History

   
   Jun, 2015   Silver Paste for Terminal Electrodes of MLCC was developed.
   Jul, 2015   Thermal Conductive Silicone Compounds were developed.
   Dec,2014   We have been developed to be a company limited by shares
   May,2014   We moved to Xinma Industrial zone to adapt fast business growth
   January,2014   Silver Paste for Touch Panel are new business growth point
   ,2013   Copper Paste was developed,which replace noble metal paste,cost saving
   ,2013   Solar Cell Front Side Silver Paste entered into market
   ,2012   Epoxy Conductive Adhesive was developed
   ,2011   Solar Cell Paste entered into market
   ,2010   New Aluminum substrate Paste
   ,2009   Solar Cell Al Paste was developed and with good market response
   ,2008   Hunan LEED Thick Film Paste Co,Ltd was established
   ,2005   Vehicle Windshield Silver Paste was developed
   ,2002   Thick film paste was developed by thick film Dep't of LEED Group;Obtained several thick film paste patents


Add:Bld2, No.8 Jinlong Rd, Xinma Industrial Zone, Tianyuan District, Zhuzhou, Hunan Province, China     

TEL: (00)86-731-22976367 FAX: (00)86-731-22976365

Email: ec@leed-ink.com        Zip code:412007

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